Process and Manufacturing Engineer

Jones Microwave Inc. is seeking a highly skilled and motivated Process and ManufacturingEngineer with deep expertise in advanced microelectronics packaging to lead thedevelopment and integration for high-frequency microwave and photonic systems. The idealcandidate will have a BSc in Electrical Engineering (or higher), and 10+ years of industry experience in advanced packaging, process development, and manufacturing of RF and optical systems. Experience with solid-state devices, microfabrication, and photonic integration is highly desirable.As part of our cutting-edge R&D team, you will not only contribute technically but also managecomplex projects and staff resources. You will lead teams in the design, simulation, and testingof advanced microelectronics packaging solutions, ensuring project timelines and resourceallocations align with the company's strategic goals. Additionally, you will report directly to theCEO, providing regular updates on project progress, team performance, and strategicinitiatives.Objectives:1. Lead the design and implementation of integrated packaging solutions for RF andoptical modules, including VCSELs, LEDs, and photoconductive switches.2. Develop and optimize manufacturing process for multi-throw switch matrices,transmit/receive modules, and multi-band microwave systems.3. Integrate driver and control circuitry with optical modules, ensuring high-speedswitching and reliable performance.4. Collaborate with subcontractors and internal teams to fabricate, assemble, andcharacterize packaged components and systems.Key Responsibilities:Packaging Design & Integration: Design packaging architectures for RF and optical components, including die attach, wire bonding, flip-chip, fiber alignment, and thermal management.Process Development: Develop and document repeatable manufacturing processes for high-frequency microwave and photonic devices, ensuring scalability and reliability.Simulation & CAD: Simulate packaging layouts and prepare CAD designs for fabrication, integrating electrical, optical, and mechanical constraints.Fabrication Oversight: Work with subcontractors and cleanroom facilities to fabricate and assemble components, ensuring quality and adherence to specifications.Testing & Characterization: Measure optical power density, switching speed, RF performance, and thermal behavior using oscilloscopes, power meters, and network analyzers.Quality Assurance: Conduct microfabrication inspections and qualification of subcontractor work, ensuring compliance with internal standards.Documentation & Reporting: Prepare technical reports, document project milestones, and present results to internal teams and leadership.Proposal & IP Support: Contribute to grant proposals, industry funding applications, and patent submissions.Outreach & Promotion: Represent Jones Microwave at conferences, trade shows, and customer meetings to showcase technology and build partnerships.Qualifications:Education: BSc in Electrical Engineering (or higher) or related field.Experience: Minimum 10 years of industry experience in RF and optical packaging, microfabrication, and process engineering.Technical Skills:Expertise in packaging of RF/microwave and optical components.Experience with cleanroom tools and microfabrication processes (e.g., lithography, etching, deposition, wafer bonding).Familiarity with simulation tools (e.g., Ansys, SolidWorks) and CAD software.Hands-on experience with packaging equipment and optical/RF test instruments.Knowledge of industry standards (IPC, MIL-STD, Telcordia) and reliability testing.Additional Skills:Excellent oral and written communication skills for technical reporting and internal/external presentations.Ability to organize and conduct complex R&D projects involving multiple stakeholders.Strong work ethic and ability to meet aggressive milestones under tight deadlines.Comfortable making decisions under pressure and working with diverse teams.Highly motivated and capable of independent research and development with minimal supervision.Preferred Experience:Background in microwave circuits and antennas, high-frequency microelectronics,photonic integration, or MEMS-based systems.Familiarity with IP protection and proposal development.Strong leadership and project management capabilities.Benefits:Competitive salary and performance-based bonuses.Comprehensive health, dental, and vision insurance.Opportunities for professional growth and development.Collaborative and innovative work environment.If you are passionate about advancing the state-of-the-art in high-frequency microwavehardware and enjoy solving complex technical challenges, we encourage you to apply for thisexciting opportunity at Jones Microwave Inc.To Apply:Submit your resume, cover letter, and any relevant project or research work totom@jonesmicrowave.com.