We're Hiring! Electrical Engineer (Mid-Level, R&D – Robotics)

We're Hiring! Electrical Engineer (Mid-Level, R&D – Robotics)Experience: 3–5 yearsLocation: Los Angeles, CASalary: 90K-100K AnnuallyTeam: Research & DevelopmentBenefits: Full Comprehensive & Flexible PTOAbout The RoleThis role is a chance to join Hidonix’s R&D team and work on the core electronics behind our next-generation robotics systems. You’ll design advanced multi-layer PCBs, power systems, RF circuits, and sensor integrations while taking prototypes from concept to validation. At Hidonix, you’ll work closely with a talented cross-functional team, gain real ownership, and help build innovative hardware in a fast-moving environment. With strong benefits, flexible PTO, and a culture focused on engineering excellence, it’s a great place to grow your career.Role & ResponsibilitiesElectrical Architecture & PCB Design Own the end-to-end design of complex, multi-layer embedded PCBs — from schematic capture to layout, fabrication, and validation. Define board-level stack-ups, impedance targets, and power-domain topologies for high-performance ARM-based systems. Select and qualify components, maintain BOMs, and coordinate with fabrication and assembly vendors through prototype and low-volume production.Power Systems & Battery Integration Design robust, high-efficiency multi-rail power delivery networks supporting advanced processors, sensors, and communication modules.Integrate and optimize lithium-polymer battery management, protection, and charging systems for portable and wearable devices. Analyze power integrity, transient response, and thermal performance under dynamic load conditions. RF & High-Speed Design Design and validate RF subsystems, including antenna layout, impedance matching, and coexistence strategies for Wi-Fi, Bluetooth, GNSS, and cellular modules.  Execute high-speed interface routing (DDR, eMMC, USB, MIPI) with attention to impedance control, length matching, and signal integrity across multi-layer stackups. Use VNAs, spectrum analyzers, and simulation tools to characterize and optimize antenna and interconnect performance. Sensor & Peripheral Integration Integrate IMUs, barometers, GNSS receivers, and other environmental or motion sensors into compact, low-noise electrical architectures. Develop and validate supporting analog and digital signal-conditioning circuits and protection networks. Perform performance benchmarking, EMI/EMC testing, and design iteration for reliability and manufacturability. Prototype Validation & Bring-Up Lead prototype bring-up, electrical validation, and design verification using oscilloscopes, logic analyzers, VNAs, and power analyzers. Debug hardware issues at board and system levels through structured analysis, measurement, and redesign.Collaborate with mechanical and product design teams to ensure seamless electrical-mechanical integration. Documentation & Collaboration Maintain rigorous design documentation, revision tracking, and release notes. Participate in design reviews, integration meetings, and Agile development sprints to align hardware milestones with overall system goals.Required QualificationsBachelor’s or Master’s in Electrical Engineering, Electronics, or a related field.3–5 years of professional experience in embedded hardware or robotics electronics design.Proven expertise in multi-layer PCB design (Altium, KiCad, or equivalent) with controlled impedance and high-speed layout.Strong foundation in analog/digital circuit design, power regulation, and signal integrity principles.Hands-on experience in RF design and antenna tuning, including lab characterization and simulation.Skilled in using test equipment such as oscilloscopes, VNAs, logic analyzers, and power analyzers.Strong analytical and troubleshooting skills with attention to detail and documentation discipline.Comfortable working in a fast-paced, cross-functional R&D environment.Preferred QualificationsExperience with DDR or high-speed memory interfaces and signal integrity simulation workflows.Familiarity with design for manufacturability (DFM), EMC/EMI compliance, and thermal design.Exposure to product certification and validation workflows for embedded or wearable devices.Proficiency in hands-on prototyping, soldering, and rework for surface-mount and fine-pitch components.Other RequirementsMust be US Citizen or permanent Green Card holder.Must be commuting distance of Santa Monica, CA.Why Join HidonixCollaborative, supportive team culture where cross-functional work is the norm and everyone contributes to problem-solving.Work with a top-tier, multidisciplinary team across R&D, engineering, and product.Fast-paced, innovation-driven culture that values creativity, problem-solving, and technical mastery.Flexible PTO and comprehensive benefits that support work–life balance.Salary of 90K-100K Annually.