Monday, October 27, 2025
STATS ChipPAC

Director of Business Development

Posted: Oct 20, 2025

Job Description

Job SummaryQualified candidate will be responsible to create business development plans in support of strategic markets, factory product lines, and R&D initiatives. Drive new business, increase market share of the existing business with the sales team. Develop opportunities with new customers, new product lines within existing customers, and for advanced products. Work with R&D to assess gaps between customers and OEM technical requirements, competitor capabilities and SCL's capabilities. Represent SCL at customer technical review meetings /business review meetings as requested by Sales team. Candidates must be technically proficient in semiconductor packaging, test, market, customer interface, and team work.Key Responsibilities• Create and lead business development plans in support of strategic markets, factory product lines, and R&D initiatives.• Identify product, strategic market, and customer issues and communicate required courses of action to factory, work closely with regional sales team to develop account list, generate account and regional growth plans and identify and execute on target opportunities.• Assists Sales department in providing technical product/service information.• Own the Market Requirements Document process and Statement of Work (SOW) for launching R&D projects• Take lead and represent JCET in industry organizations by serving on committees, chairing conferences, etc.• Attending key networking events to promote and pitch JCET• Author technical papers and speak at industry events to promote JCET• Executive interface with technical teams for key accounts• Provide customer technical support for projects that require development or technical expertiseRequirements:Broad expertise and unique knowledge, uses skills to contribute to development of company objectives and principles and to achieve goals in creative and effective waysExercises independent judgment in methods, techniques and evaluation criteria for obtaining results. Creates formal networks involving coordination among groups.Acts independently to determine methods and procedures on new or special assignmentsTypically requires a minimum of 15 years of related experience with a Bachelor’s degree; or 10 years and a Master’s degree; or a PhD with 8 years’ experience; or equivalent experienceExtensive experience in the semiconductor industry especially in OSAT business development, or engineering work related to semiconductor packaging industry.Very good understanding of semiconductor packaging technology such as wirebond, flip chip, wafer level, 2.5D/3D packaging including wafer bump and test.Good understanding of package design and tools, mechanical, thermal and electrical simulation workExcellent program management skillsAble to analyze market data and sales strategyExcellent verbal and written communication skillsSelf-motivated and self-directed, able to multi-task, prioritize, and manage time effectively in diverse work environments.Proficient computer skills, Microsoft Office (Word, PowerPoint, Outlook, and Excel), etc.Ability to travel 20% of the time

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