Packaging Manager

Packaging Design ManagerOur client is a leading company in the semiconductor industry, specializing in innovative IC packaging solutions. With a strong track record of developing advanced packaging technologies, including fcBGA and multi-layer substrate designs, they are committed to providing cutting-edge solutions for a variety of applications. Their focus on quality, efficiency, and customer satisfaction has positioned them as a trusted partner in the market. They are now looking to expand their team and bring in top talent to support their continued growth and innovation in packaging design and development.Key ResponsibilitiesDrive the design and development of advanced IC packaging solutions, overseeing the process from initial concept through final design verification.Collaborate with cross-functional teams—including signal/power integrity, substrate, assembly, and testing—to ensure manufacturable designs and timely product completion.Guide and support junior engineers, establish design standards, and maintain technical documentation for internal and external use.Key QualificationsBachelor’s or higher degree in Electrical Engineering, Computer Science, or related field, with significant experience in IC package design (ideally 7+ years).Strong background in complex packaging, including fcBGA and multi-layer substrate layouts, with proficiency in industry-standard design tools such as Cadence APD or SIP.Analytical, solution-oriented, and highly collaborative, with experience interfacing across engineering, manufacturing, and supplier teams.If you are interested in this opportunity, please ‘Apply Now’ or email your CV to grantzhou@trulyyy.com. Referrals are greatly appreciated.Regrettably, only shortlisted candidates will be notified.Please note that data provided is for recruitment purposes only.Business Registration No.: 202004228R | License No.: 20S0118 | EA Registration No.: R2210710