Senior Process Development Engineer

Senior Process Engineer – Help Pioneer the Future of Optical Computing Hardware!Gardena, CA | OnsiteOpportunity SummaryA well-funded stealth startup is developing breakthrough optical computing hardware designed to surpass the limitations of traditional electronics. Backed by experienced founders and early-stage investors, the team is combining advanced photonics, packaging, and manufacturing under one roof. We’re looking for a Senior Process Engineer to lead key development efforts in wafer and die-level packaging. This role is hands-on, highly technical, and central to launching our first product.About UsWe’re an ambitious group of engineers, scientists, and builders focused on optical computing innovation. Our startup combines experience from previous frontier tech ventures with a shared mission to redefine how light is used in computational systems. With early funding secured, we're building both the hardware and the factory floor to scale it, developing vertically integrated systems that blend photonics, electronics, and manufacturing into a cohesive, next-generation computing platform.Job DutiesDevelop and own process recipes for wafer-level and die-level packaging techniques, including eutectic bonding, flip-chip attachment, underfill, and protective coatingsAchieve high-yield bonding (>99.9%) and ensure thermal reliability through 20,000+ cyclesAnalyze failure mechanisms using X-ray, SAM, SEM/TEM, shear testing, and other methods, feeding results back into process and design improvementsLead the transition of R&D processes into repeatable, high-volume production workflows using SPC and tool selection methodologiesServe as technical lead for corrective actions stemming from root cause analysis and field dataCollaborate across design, electrical, and mechanical engineering teams to fine-tune packaging architectureSupport hiring efforts and mentor junior engineers to grow internal manufacturing capabilitiesQualificationsMS or PhD in Materials Science, Electrical Engineering, Chemical Engineering, or a related field3+ years of hands-on experience in semiconductor process development or advanced packagingProven track record developing and qualifying bonding processes such as eutectic, flip-chip, or hybrid methodsStrong command of statistical quality control practices and continuous improvement strategiesComfortable working in a fast-paced lab and production environment, including extended hours when neededPreferred ExperienceBackground in nanofabrication techniques (e-beam lithography, dry etch, PECVD, CMP)Experience integrating photonic components such as SiPh or InP into electronic packagesPrior work with optoelectronic device packaging or hybrid integrationWhy Join UsHigh-impact opportunity at the forefront of photonics and next-gen computingSeed-funded startup with ambitious growth plans and hands-on technical leadershipEarly-stage equity and long-term incentive plansFlexible work culture and strong support for innovationRelocation assistance to Southern CaliforniaComprehensive health coverage: medical, dental, and visionPaid parental leave, flexible vacation policy, and company holidaysCompensation Details$120,000 - $200,000 plus equity