Manufacturing Process Lead Engineer

SummaryWe are looking for a highly experienced Senior Engineer specializing in Printed Circuit Board Assembly (PCBA) to drive and execute process improvements with a strong focus on New Product Introduction (NPI), preferably from High-Mix Low-Volume (HMLV) manufacturing environments.The ideal candidate will leverage deep technical expertise to optimize PCBA processes, ensure scalable and high-quality solutions, and champion continuous improvement in yield, quality, and cost efficiency as an individual contributor and technical leader.Key ResponsibilitiesPerforms tasks such as, but not limited to, the following:Manufacturing Process Engineering & NPI ExecutionDrive the technical execution of end-to-end NPI activities for PCBA, ensuring a robust and smooth transition from design to mass production.Collaborate closely with the Internal DFM team, customers, manufacturing peers, and suppliers to ensure all DFM/DFT (Design for Manufacturing/Test) requirements are defined, met, and successfully implemented.Apply advanced problem-solving skills to resolve complex technical challenges and production bottlenecks during prototyping, pilot runs, and production ramp-up.High-Mix Low-Volume (HMLV) Process ExpertiseTechnically own and optimize PCBA processes for HMLV environments, ensuring maximum flexibility, high uptime, and efficiency.Execute technical tasks related to BOM scrubbing, component obsolescence resolution, and alternate component qualification.Partner with the internal equipment team to define, implement, and qualify processes that enable quick changeovers and minimal equipment downtime.Yield & Quality ImprovementDevelop, implement, and qualify technical process improvements such as PFMEA, poka-yoke mechanisms, and custom tooling (Jigs/fixtures) to achieve world-class first-pass yield.Lead and execute deep-dive Root Cause Analysis (RCA) for complex PCBA failures and drive the implementation of robust corrective and preventive actions (CAPA).Establish, monitor, and report on key process and quality metrics, and champion continuous improvement initiatives utilizing methodologies like Six Sigma and Lean.Cost-Saving & Lean InitiativesIdentify, champion, and technically execute cost-reduction opportunities in material, process, and overhead areas without compromising quality or reliability.Implement Lean manufacturing principles and tools (e.g., Value Stream Mapping) to eliminate process waste within PCBA production lines.Optimize process yield to significantly reduce bonepile/scrap inventory, directly supporting HMLV inventory management goals.Cross-Functional Collaboration & Technical CommunicationServe as the primary technical subject matter expert for PCBA processes within the organization.Work closely with Test Engineering, Operations (Production), and QA teams to ensure process robustness, control, and product reliability.Prepare and present technical data, project status, and key process findings to cross-functional stakeholders.Qualifications & SkillsEducation & ExperienceBachelor’s degree in Electrical/Electronic Engineering, Mechanical Engineering, or a related technical field. Master’s degree preferred.5+ years of hands-on, progressive experience in PCBA manufacturing and New Product Introduction (NPI).Proven track record of technical execution in HMLV manufacturing, yield improvement, and cost reduction.Expert-level, practical working knowledge of IPC standards (IPC-A-610, IPC-7351) and all aspects of the PCBA assembly process (Stencil Printing, SMT, Reflow, Wave, Selective Soldering, AOI/AXI).Demonstrated proficiency in applying methodologies such as Six Sigma, Lean, and Kaizen to solve complex technical problems.Soft SkillsExceptional analytical problem-solving skills and a strong sense of technical ownership.Effective cross-functional collaboration and communication skills.Highly data-driven and detail-oriented approach to decision-making.Preferred QualificationsDeep technical experience in developing and sustaining manufacturing processes for PCBA assembly.Technical knowledge of thermal/mechanical stress analysis for reliability assessment.Background in Industrial and Test measurement product compliance and qualification.